Govt notifies Rs 1,27,500-crore Semicon 2.0; spells out eligibility norms, sops for chip ecosystem

New Delhi, Aug 31: The government on Monday notified the Semicon 2.0 scheme, setting in motion the Rs 1,27,500-crore plan that seeks to deepen India’s semiconductor ambitions — from chip manufacturing to a full-stack ecosystem encompassing indigenous design and IP, equipment, materials, advanced packaging, R&D and talent development.

The move comes at a time when semiconductors have emerged as a critical strategic resource globally, with the AI boom driving unprecedented demand for advanced chips and memory. At the same time, growing concerns over supply-chain vulnerabilities and shifting geopolitics have pushed global players to expand semiconductor capacities and reduce dependence on concentrated production hubs.

The Semicon 2.0 scheme was approved by the Union Cabinet on July 15, 2026. The notification on Monday spells out the contours of the new programme detailing how the Rs 1,27,500-crore outlay will be implemented, and how incentives will be structured, and the eligibility criteria for various categories.

“Now the time is ripe to move to next stage to develop semiconducor ecosystem through Semicon 2.0. The objective of the scheme is self reliance and fostering a globally competitive industry,” IT Secretary S Krishnan said at a briefing.

For design of chips for commercial sector, the eligibility will be startups, and companies owned by Indian citizens or OCI.

For startups, financial support will be in the form of grant and equity co-investment, and for companies it would be in the form of royalty financing or equity co-investment.

When it comes to setting up more fabs, the new scheme will provide 40 per cent fiscal support for silicon fabs and 35 per cent for compound, display (LCD, OLED, micro LED), and other specialised fabs.

For strengthening ATMP/OSAT, (Assembly, Testing, Marking and Packaging/Outsourced Semiconductor Assembly and Test), it supports advanced and legacy packaging with an incentive of 35 per cent of capex for advanced packaging and 25 per cent of capex for conventional packaging.

Previously, under the first phase of the programme, the government had approved 12 semiconductor projects across six states, with three facilities–Micron’s ATMP plant, Kaynes Semicon and CG Semi OSAT facility–having commenced commercial production earlier this year. (PTI)

Hot this week

Pay hike of Assam ministers, MLAs likely as 3-member panel submits report

Full report likely by Oct 30 Guwahati Sept 25: There...

Meghalaya Biological Park Inaugurated After 25 Years: A New Chapter in Conservation and Education

Shillong, Nov 28: Though it took nearly 25 years...

ANSAM rejects Kuki’s separate administration demand, says bifurcation not acceptable

Guwahati, Sept 8: Rejecting the separate administration demand of...

Meghalaya’s historic fiber paves the way for eco-friendly products and sustainable livelihoods

By Roopak Goswami Shillong, Oct 25: From making earbuds to...

Meghalaya man missing in Bangkok

Shillong, Jan 10: A 57-year-old Meghalaya resident, Mr. Treactchell...

Merger of 9 UDP MLAs with BJP is Delhi’s call: AL Hek

SHILLONG, AUG 31: Senior BJP leader and Pynthorumkhrah MLA...

Nepal floods: 933 missing from hydropower project sites; rescue efforts intensify

Nuwakot (Nepal), Aug 31: Nepal's rescue teams are trying...

2 villagers killed in gun attack in Manipur’s Kangpokpi

Imphal/ Kangpokpi, Aug 31: Two villagers were killed and...

Ankur wins maiden WTT title, doubles gold in Czechia

New Delhi, Aug 31: Indian paddler Ankur Bhattacharjee produced...

Gujarat extends ban on manufacture, sale of gutkha, paan masala till September 2027

Ahmedabad, Aug 31: The Gujarat government on Monday said...

Indian para paddlers sign off with 16 medals in Finland

New Delhi, Aug 31: India signed off with a...
spot_img

Related Articles

Popular Categories